Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
●Six-sided electroplating, salt spray resistance over 24h
●Precise tacking
●Small solder joint, no oxidation or breakdown.
●High gas tightness, high corrosion resistance and high reliability
●Independent production in whole process including lid forming,
lid electroplating, solder preform forming and precise tacking
●2~10 μm AuSn solder layer deposited by PVD method
●Alloy film with good solderability
●End products and AuSn coating processing services available
●Possessing process capability of thin film circuit manufacturing
including lithography, deposition and scribing
●Self-developed active brazing material
●Whole process flow self-controlled
●Ultra-low interface void, high thermal conductivity
●Excellent temperature shock resistant, high reliability
●Self-developed nano-Ag dispersing system, RoHS compliant
●Pressureless or pressure-assisted sintering
●Low sintering temperature and high working temperature
●High connecting strength, excellent electrical and thermal conductivity
●Alternative to high-lead solder
●No organic residue, cleaning free
●Excellent wettability, high corrosion and oxidation resistance
●Easy to clean after soldering
●Good sphericity
●Fast delivery, 1 week delivery
●Long shelf life, 6 months
Manufacturer of Advanced Semiconductor Connecting Materials
Providing technical consulting service and solutions
Founded in December 2008,Guangzhou XianYi Electronic Technology Co., Ltd.,is a national high-tech enterprise integrating R&D, production and sales of advanced packaging and connecting materials, and a well-known domestic micro-assembly material solution provider.