Features:

- Eutectic solder, melting point 183°C

- Good mechanical properties

- Good electrical and thermal conductivity

- High reliability and corrosion resistance of solder joints

- Good solderability, better than lead-free solder

- Good appearance of solder joints for easy inspection 

Description:

Sn63Pb37 is a tin-lead eutectic solder with a eutectic point of 183°C. Tin-lead solder has always been the main soldering material for electronic assembly, especially the Sn63Pb37 solder alloy with eutectic composition because of its low melting point (183°C), good soldering properties (good wetting and spreading, low surface tension) etc.) and performance have become the main welding material for electronic assemblies, and are widely used in the assembly of military, aerospace and civil electronic products.

With the increasing attention to the environment, lead-free solders are gradually replacing lead-containing solders due to the toxicity of Pb, but the wetting properties of lead-free solders developed so far have always been inferior to tin-lead solders.

Solder composition and properties:   

Solder Composition:

Physical Properties:

Operation details:

- Solder taking：

   Use an anti-static jig to pick up the solder to prevent solder contamination and deformation.

- Flux Compatibility:

  Sn63Pb37 solder is compatible with the major no-clean and water-soluble electronic grade fluxes currently on the market.

Processing size:

Storage and Product Management:                                       

-Storage

The best storage temperature of this product is 25±5℃, and the relative humidity is less than or equal to 55%RH.

-Product management

Keep container tightly closed when product is not in use.

Safety:                                                      

-Please use this product with adequate ventilation and certain personal protection conditions.

-Please do not mix with other toxic chemicals.