Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
AuSn Solder Seal Lids
The AuSn solder seal lid consists of a lid with a gold-tin solder preform tack-welded on it. With the self-developed six-side electroplating process and micro spot welding technology, the corrosion resistance and firmness of the product are guaranteed, the positioning problem existing in the traditional process is solved, and the packaging process is simplified. The product has been widely used in hermetic packaging of microwave RF modules, FPGA, MEMS devices and optoelectronic devices.
▶Features
▪ Six-sided electroplating, salt spray resistance over 24h
▪ Precise tacking
▪ Small solder joint, no oxidation or breakdown.
▪ High hermeticity, high corrosion resistance and high reliability
▪ Independent production in whole process including lid, solder preforms and precise tacking
▪ Fast delivery, 3 weeks
▶Specifications
Composition | Au80Sn20, Au78Sn22 |
Lid Material | 4J29，4J42 |
Lid Finishes | Ni / Au , Ni / Au / Ni / Au Hard/soft gold plating available *Plating structure can be customized according to customer requirements. |
