Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
● | 2024 |
![]() | ● National "Little Giant" Enterprise (Review). ● In 2023, AuSn Thin Film Heat Sinks Appraised as premium quality products in Guangdong. ● The Benchmark Enterprise of Innovation and Technology Industry Award. ● AMB Ceramic Substrates、AuSn Solder Preforms、AuSn Solder Pastes and AuSn Solder Seal Lids were selected into The Circular of the Ministry of Industry and Information Technology on the Release of the Guidance Catalogue for the First Batch of Application Demonstration of Key New Materials (2024 Edition). ● AuSn Solder Preforms、AuSn Solder Seal Lids and AMB Ceramic Substrates were selected into "Catalog of Guangzhou Innovative Product ". ● Participated in the formulation of national standard GB/T 43755-2024 "Preformed solder". ![]() |
| ● | 2023 |
![]() | ● National High-tech Enterprises (Fourth time Review). ● Guangdong Province specializes in special new SMEs (Review). ● THE FIRST GUANGZHOU'S TOP 100 EMERGING ENTERPRISES. ● "Chip-level micro-assembly interconnection materials and devices for gold-tin eutectic packaging" project participated in the 12th China Innovation and Entrepreneurship Competition, and won the first prize in the growth group of Guangdong Competition, and the outstanding enterprise in the National Competition. ● 2023 Guangdong-Hong Kong-Macao Greater Bay Area New Materials Innovation Enterprise 50 Award Ceremony, Gold Award, Best in SME Innovation and Investment Value. ● Top 100 of the 8th "Maker China" Guangdong SME Innovation and Entrepreneurship Competition, and the second prize of the 7th "Maker Guangdong" Semiconductor and Integrated Circuit Special Competition. ● 2023 Power Device Ceramic Substrate - The Most Promising Supplier. ● AuSn Solder Paste,Au88Ge12 Solder Preforms,AuSn Solder Seal Lids was rated as "2022 Annual Guangdong Famous and Excellent High-tech Products".
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● | 2022 |
| ● Guangdong Engineering Research Center of Semiconductor Microconnection Packaging Materials. ● ISO14001 Environmental Management System. ● 2022 Guangzhou "Bellwether" Top 10 best growth enterprises. ● "The third generation of power semiconductor Silicon Carbide IC Ceramic Substrates (AMB)" project participated in the 11th China Innovation and Entrepreneurship Competition, and won the first prize in the growth group of Guangzhou Competition, the first prize in the growth group of Guangdong Competition, and the outstanding enterprise in the National Competition. ● “Au80Sn20 Gold Tin preformed solder for highly reliable electronic packaging” was rated as a famous high-tech product in Guangdong Province.
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● | 2021 |
![]() | ● State-level Technologically Advanced "Little Giants" Enterprises. ● 2021 China's advanced electronic new material enterprise. ● Passed IATF 16949: 2016 Automobile Quality Management System Certification. ● Gold-Tin Solder Paste products were selected into the first batch of application demonstration guidance catalogue of key new materials in Guangzhou (2020 edition). ● Led the development of the group standard TCWAN0021-2021 "AuSn Solder Preforms and Application Specification"
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● | 2020 |
| ● National High-tech Enterprises. ● Guangdong Province specializes in special new SMEs. ● Innovation Practice Base of Huazhong University of Science and Technology.
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● | 2019 |
| ● Successfully developed the "Gold-Tin Solder Paste" product (the first in China). ● Passed GJB 9001C-2017 Weapon Equipment Quality Management System Certification. ● Introduction and operation of MES industrial Internet manufacturing intelligent management system. ● Au80Sn20 products were selected into the first batch of application demonstration guidance catalogue of key new materials in Guangzhou (2018 edition).
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● | 2018 |
| ● The revision has passed GB/T 19001: 2016/ISO 9001: 2015 quality management system certification. ● passed GB/T 29490-2013 intellectual property management system certification. ● 2018 Top 100 Contributors to the Development of China's Power Semiconductor and Equipment Industry. ● The 7th China Innovation and Entrepreneurship Competition Winner Award.
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● | 2017 |
| ● Top 100 Technological Innovations in Panyu District in 2017. ● National High-tech Enterprises.
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● | 2016 |
| ● Guangzhou Enterprise R&D Institutions.
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● | 2015 |
| ● Join ITRI China Solder Technical Council. |
● | 2014 |
| ● National High-tech Enterprises. |
● | 2011 |
| ● Guangzhou Private Technology Enterprise. |
● | 2010 |
| ● passed ISO9001:2008 quality management system certification. |
● | 2014-2018 |
| ● AuSn Solder Preforms. Au88Ge12 Solder Preforms and AuSn Solder Seal Lids obtained titles of Guangzhou scientific and technological achievements. |
● | 2010-2022 |
| ● A total of 60 invention patents and utility model patents were authorized.
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● | 2009-2016 |
| ● Many projects have been approved by municipal, provincial and national science and technology projects. |