Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
AuSn Solder Paste
AuSn solder paste is a high reliability high temperature solder paste, flexible and diversified in use in comparison with AuSn preforms. AuSn solder paste is very suitable for the high reliability packaging of micro optoelectronic devices and high thermal conductivity packaging of large power devices.
Features
l Excellent wettability, high corrosion and oxidation resistance
l Easy to clean after soldering
l Fast delivery, 1 week delivery
l Long shelf life, 6 months
Specifications
Product Type | Composition | Viscosity(Pa·s) | Melting Temperature (℃) | Applicable Process | Powder Particle Size (μm) | Package | Storage | |
Syringe Pack | Can Pack | |||||||
XY-ASP-001 | Au80Sn20 | 180~300 | 280
| Printing/ Dispensing | 3#: 25-45μm 4#: 20-38μm 5#: 15-25μm 6#: 5-15μm | 2g, 5g, 10g, 20g | 100g, 200g | 0-10℃ |
XY-ASP-002 | Au78Sn22 | 180~300 | ||||||
XY-ASP-003 | Au80Sn20 | 10~130 | ||||||
XY-ASP-004 | Au78Sn22 | 10~130 | ||||||
Applications
Semiconductor Cooler Welding
