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Integrated Heat Spreader

IC heat spreaders, typically copper-based, rapidly and uniformly spread heat from the chip to a larger surface, greatly improving heat dissipation efficiency while protecting the chip from damage. They are widely used in components such as CPUs and GPUs to enhance hardware performance and reliability, and to prevent damage caused by overheating.

▶Features

▪ Shapes: ring, hat, cavity, and custom profiles

▪ Surface Ni plating, selective Au plating,indium pre-attached available

▪ Dimple process option

▪ Full in-house process control


▶Specifications


Material

C1100, SUS304,etc.

Plating

Ni, Ni/Au

Dimension Tolerance

±0.05 mm

Flatness

0.05 mm

Surface Roughness

Ra 0.2~1.1μm

Gloss

30~50 GU(typical)