Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Indium Solder Seal Lids
Indium-based solders are common in low-temperature hermetic sealing, especially for metal lids. Due to the softness and easy deformation of indium, traditional assembly and alignment are challenging, affecting efficiency and yield. Xianyi innovatively pre-positions and fixes indium frames onto lids, integrating solder with the lid, so no additional solder is needed during window or package sealing. This solves handling difficulties and simplifies the process, widely used in IR FPA detectors and other semiconductor devices.
▶Features
▪ Double-sided indium preforms, simplifying assembly
▪ Firm attachment, precise positioning
▪ Suitable for high-reliability hermetic sealing
▪ Full capability: forming, plating, pre-attachment
▶Specifications
Base Material | 4J29、4J42,etc. |
Plating | Ni：1.27~8.9 μm Au：0.65~5.7 μm * The plating can be adjusted according to customer requirements. |
Plating Quality | Meet the requirements of "GJB1420B-2011 General Specification for Semiconductor Integrated Circuits" |
Solder Alloys | In, In97Ag3 |
Solder Thickness | 0.05~1mm |
Solder Positioning Accuracy | 0.07mm |
