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Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,
Providing technical consulting service and solutions
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Interconnecting Materials for Electronic Packaging
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AuSn Solder Paste
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Solder Wire & Paste
Flux
Integrated Solder Components
AuSn Solder Seal Lids
Pre-soldered AuSn Multilayer Ceramic Substrate
Pre-soldered AuSn Window
Indium Solder Seal Lids
Pre-soldered Indium Ceramic Ring
Pre-soldered Pin
Pre-soldered AuGeCu Plate
AuSn Thin Film Heat Sinks
High-performance Metallic Thermal Interface Materials
Indium TIM
Integrated Heat Spreader
Flux for TIM Indium
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
High-Cleanliness Solder Preforms
Embedded Copper Wire Solder Sheet & Ribbon
Low-Void Solder Paste
Ag Sinter Paste
IMC Solder Films
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online service
Xianyi Products
Interconnecting Materials for Electronic Packaging
Solder Preforms
List of Common Solders
Gold-Based Solders
Silver-Based Solders
Indium-Based Solders
Tin-Based Solders
Flux Coated Solder Preforms
Packaging Solutions for Automatic Feeding
AuSn Solder Paste
Solder Balls
Gold Bonding Wire & Ribbon
Solder Wire & Paste
Flux
Integrated Solder Components
AuSn Solder Seal Lids
Pre-soldered AuSn Multilayer Ceramic Substrate
Pre-soldered AuSn Window
Indium Solder Seal Lids
Pre-soldered Indium Ceramic Ring
Pre-soldered Pin
Pre-soldered AuGeCu Plate
AuSn Thin Film Heat Sinks
High-performance Metallic Thermal Interface Materials
Indium TIM
Integrated Heat Spreader
Flux for TIM Indium
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
High-Cleanliness Solder Preforms
Embedded Copper Wire Solder Sheet & Ribbon
Low-Void Solder Paste
Ag Sinter Paste
IMC Solder Films
Low-Void Solder Paste
