Integrated Solder Components,Products - Guangzhou XianYi Electronic technology Co.,Ltd.

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Xianyi Products

Interconnecting Materials for Electronic Packaging

Solder Preforms

List of Common Solders Gold-Based Solders Silver-Based Solders Indium-Based Solders Tin-Based Solders Flux Coated Solder Preforms Packaging Solutions for Automatic Feeding

AuSn Solder Paste

Solder Balls

Gold Bonding Wire & Ribbon

Solder Wire & Paste

Flux

Integrated Solder Components

AuSn Solder Seal Lids

Pre-soldered AuSn Multilayer Ceramic Substrate

Pre-soldered AuSn Window

Indium Solder Seal Lids

Pre-soldered Indium Ceramic Ring

Pre-soldered Pin

Pre-soldered AuGeCu Plate

AuSn Thin Film Heat Sinks

High-performance Metallic Thermal Interface Materials

Indium TIM

Integrated Heat Spreader

Flux for TIM Indium

Electronic Packaging Materials for Third-Generation Power Semiconductor

AMB Ceramic Substrates

High-Cleanliness Solder Preforms

Embedded Copper Wire Solder Sheet & Ribbon

Low-Void Solder Paste

Ag Sinter Paste

IMC Solder Films

Integrated Solder Components

Xian Yi provides self-developed electronic packaging materials for third-generation power semiconductor.

How to select the most suitable electronic packaging materials for third-generation power semiconductor, please contact us. Our technical support engineers will serve you wholeheartedly.