Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
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The Five Technical Ladder Levels of Packaging Engineering
Many people assume packaging only means putting a housing around a chip. In reality, packaging engineering is a tiered integration system spanning from the die .
2026-11-05 Industry News 0
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Push Cooling Boundaries! Xianyi Electronics Sintered Silver Paste Reinforces Power‑Package Reliability
Driven by rapid development of 5G communications, new‑energy vehicles and high‑power LEDs, conventional bonding materials can no longer satisfy increasingly r.
2026-11-05 Industry News 0
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Why TIM Is an Indispensable Critical Material for High‑Power Chips
Thermal Interface Material (TIM) serves as the critical intermediate layer connecting chips and heat sinks. Micro‑scale surface irregularities exist on chips, .
2026-11-05 Industry News 0
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Xianyi Electronics Science & Innovation Park Officially Completed and Put into Operation
Advanced Packaging Materials & Innovative Processes Seminar Successfully Held at Xianyi Electronics Science & Innovation ParkOn September 7, 2026, Guang.
2026-11-05 Company News 0
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