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Xianyi Products

Interconnecting Materials for Electronic Packaging

Solder Preforms

List of Common Solders Gold-Based Solders Silver-Based Solders Indium-Based Solders Tin-Based Solders Flux Coated Solder Preforms Packaging Solutions for Automatic Feeding

AuSn Solder Paste

Gold Bonding Wire & Ribbon

Solder Wire & Paste

Integrated Solder Components

AuSn Solder Seal Lids

Pre-soldered AuSn Multilayer Ceramic Substrate

Pre-soldered AuSn Window

Indium Solder Seal Lids

Pre-soldered Indium Ceramic Ring

Pre-soldered Pin

Pre-soldered AuGeCu Plate

AuSn Thin Film Heat Sinks

High-performance Metallic Thermal Interface Materials

Integrated Heat Spreader

Flux for TIM Indium

Electronic Packaging Materials for Third-Generation Power Semiconductor

AMB Ceramic Substrates

High-Cleanliness Solder Preforms

Embedded Copper Wire Solder Sheet & Ribbon

Low-Void Solder Paste

Ag Sinter Paste

IMC Solder Films

Pre-soldered AuSn Multilayer Ceramic Substrate

Pre-soldered AuSn Multilayer Ceramic Substrate

▪ Substrate: HTCC ceramic

▪ Cu posts & frame pre-soldered with Au80Sn20

▪ Application: Microwave 3D SiP ceramic packaging