Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Tin-lead solder has a long history as a main brazing material in electronics assembly. Sn63Pb37 eutectic solder has a low melting temperature(183℃) and good welding performance(e.g. excellent wettability and low surface tension), which makes it to be one of the most common solder in electronics industry. Sn63Pb37 is widely used in packaging aerospace and civil electronics.
Sn63Pb37 Preforms
Sn63Pb37 eutectic solder has a low melting temperature(183℃) and good welding performance(e.g. excellent wettability and low surface tension), which makes it to be one of the most common solder in electronics industry. Sn63Pb37 is widely used in packaging aerospace and civil electronics.
Pb92.5Sn5Ag2.5 Preforms
Pb92.5Sn5Ag2.5 is a kind of high lead content[w(Pb)>85%], high melting temperature solder using widely in high temperature packaging of microelectronics. Tin-lead solder is soft solder with superior flowability and strong corrosion resistance. Moderate silver addition into tin-lead soldeer can improve heat-resistant temperature of joints to meet high reliability demand of high power device package.
We offer preform with accurate composition and meiling temperature. Shapes such as disk,ring, rectangle, frame are available to meet different demands according to your applications.
