IMC Solder Films

IMC solder film is a high‑reliability high‑temperature pre‑formed solder featuring excellent electrical conductivity, thermal conductivity, corrosion resistance and mechanical properties. Designed for service conditions ranging from 150 °C to 500 °C, it delivers outstanding performance in thermal fatigue resistance, high‑temperature strength, corrosion resistance and oxidation resistance.

Compared with nano‑silver and nano‑copper paste‑based solder films, this product enables precise thickness control at 80 μm and above. It can be freely cut and folded, and stored under ambient‑temperature air conditions. Air‑atmosphere hot‑press sintering requires no gas protection or reduction treatment; direct hot‑press reflow is achievable. Boasting flexible application and storage, it is suitable for high‑thermal‑conductivity packaging of high‑power devices.