Advanced Packaging Materials & Innovative Processes Seminar Successfully Held at Xianyi Electronics Science & Innovation Park

On September 7, 2026, Guangzhou Xianyi Electronics Technology Co., Ltd. grandly hosted the Advanced Packaging Materials & Innovative Processes Seminar at the Xianyi Electronics Science & Innovation Park. Tied to the opening of the new park, leaders, experts and industry peers from universities, research institutes and enterprises gathered to hold in-depth exchanges on the cutting-edge technologies and industry pain points of advanced packaging materials and interconnect processes, witnessing this landmark moment together.

The global semiconductor industry is undergoing profound transformation; the post-Moore era has arrived. Advanced packaging serves as a critical pillar to break through chip performance bottlenecks and reshape industrial competition landscapes. From infrared detection to LiDAR, from high-speed optical communication to AI computing chips, high-end applications impose ever more stringent requirements on packaging materials and interconnect processes. Centered on the theme “Advanced Packaging Materials & Innovative Processes”, this seminar brings together academia, research institutes and industry to focus on technological frontiers, address industrial pain points and explore collaborative innovation.

Grand Opening Ceremony: “Unite for a New Journey, Smart Manufacturing Wins the Future”

On September 8, 2026, Guangzhou Xianyi Electronics Technology Co., Ltd. reached a milestone in its development history — the Xianyi Electronics Science & Innovation Park, with an investment of nearly RMB 250 million, was officially completed and put into operation in Panyu District. The opening event under the theme “Unite for a New Journey, Smart Manufacturing Wins the Future” was held at the park that morning. Government officials, industry experts, partners and corporate representatives gathered to witness this important occasion.

Landmark High-Tech Base: 21-Mu Science & Innovation Park Launched

Located on the north side of Asian Games Avenue, Panyu District, Guangzhou, within the Golden Inner Bay of the Guangdong-Hong Kong-Macao Greater Bay Area, the Xianyi Electronics Science & Innovation Park sits in the cluster of specialized and sophisticated enterprises in Panyu. Covering an area of about 21 mu, it boasts a total floor area of 64,000 square meters.

The park features over 10,000 square meters of Class 1,000 and Class 10,000 clean smart production lines, dedicated R&D laboratories and modern office spaces. It fully supports large-scale mass production and technology iteration of four product segments: electronic packaging interconnect materials, high-performance metal thermal interface materials, integrated solder devices, and third-generation power semiconductor packaging materials. It effectively removes capacity bottlenecks for high-end advanced semiconductor packaging materials.

As the hard-tech industrial base where Xianyi Electronics deepens its engagement in microelectronic and semiconductor packaging interconnect materials, the park is a key platform implementing the national 15th Five-Year Plan strategy of “strengthening national strategic science and technology forces and breaking through core key technologies”. It aims to become a core technology source and industrial benchmark for domestic substitution within China’s semiconductor supply chain.

Opening Celebration: Auspicious Lion Welcomes Fortune, A New Journey Begins

Around 10:00 AM, the opening ceremony commenced in a lively atmosphere.

With gongs and drums, the auspicious lion performance began. The eye-dotting ceremony for the lion dance was held grandly: the lion symbolizes pioneering spirit and united progress. Chen Weimin, Managing Director of Xianyi Electronics, and Huang Jiefei, Executive President, jointly performed the eye-dotting ritual. Spectacular lion performances including “Double Fortune Bringing Blessings”, “Step by Step Up” and “High-Pole Green” were staged in succession, symbolizing a successful park opening, steady growth and enduring prosperity.

Chen Weimin, Managing Director of Xianyi Electronics, delivered the opening address first. He reviewed the company’s 18-year track record in semiconductor new materials and microelectronic packaging, and reaffirmed its firm commitment to domestic substitution built on local R&D. Zheng Shaoxin, Party Secretary of Shiji Town, delivered remarks on behalf of the local government, recognizing Xianyi’s leading role in high-end manufacturing and semiconductor innovation.

Witnessed by all guests, leaders and representatives including Su Jundan (Party Secretary and Executive Deputy Director of District Enterprise Construction Service Center), Zheng Shaoxin (Party Secretary of Shiji Town), Huang Shaoyao (Vice Chairman of the People’s Congress of Shiji Town), Wu Niansheng (President of Shiji Town Chamber of Commerce), Chen Weimin (Managing Director of Xianyi Electronics), Huang Jiefei (Executive President of Xianyi Electronics), Cheng Ling (Investment Director of SDIC Venture Capital), and Wu Yiping (Technical Director of Xianyi Electronics) jointly launched the park, officially announcing the opening of Xianyi Electronics Science & Innovation Park.

Honoring Craftsmanship: Recognition for Outstanding Construction Partners

The successful completion of the park relied on outstanding performance in engineering design, construction quality, safety management and delivery services. During the event, Xianyi Electronics presented awards to multiple partner companies.

Strategic Alliances: Three Strategic Partnerships Signed

Technological innovation is never a solo performance, but an orchestral concerto. Three strategic cooperation agreements were signed on site between Xianyi Electronics and partners, covering joint university-enterprise technology research, supply chain collaboration, and co-development of talent programs. This marks that Xianyi Electronics is building an integrated industry-academia-research-application innovation ecosystem with an open mindset.

Guests visited the park exhibition hall, clean factories and dormitory buildings in batches, observing high-end production lines for microelectronic packaging and semiconductor new materials up close.

Unite for a new journey; smart manufacturing wins the future. Founded in 2008 and reaching the completion of the science & innovation park in 2026, Xianyi Electronics has gone through eighteen years of independent R&D and dedicated craftsmanship. The park’s completion and commissioning represents not only a leapfrog upgrade in production capacity, but also a strategic move to expand into the AI computing chip supply chain and strive to become the domestic leader of high-end semiconductor packaging interconnect materials.

With this park as a new starting point, Xianyi Electronics drives industrial upgrading through technological innovation, enables cluster growth via platform co-construction, jointly overcomes industrial technical bottlenecks, enhances the core competitiveness of the Greater Bay Area electronics manufacturing industry, and supports high-quality, autonomous and controllable development of the semiconductor and electronic information industry.