Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
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Push Cooling Boundaries! Xianyi Electronics Sintered Silver Paste Reinforces Power‑Package Reliability
2026-11-05 10:58:14
Industry News
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Driven by rapid development of 5G communications, new‑energy vehicles and high‑power LEDs, conventional bonding materials can no longer satisfy increasingly rigorous thermal‑dissipation and reliability requirements. Xianyi Electronics independently developed sintered silver paste to solve these industry pain points.
Product Highlights Low‑temperature sintering for high‑temperature service: Sintering completes within 180‑250 °C; maximum service temperature exceeds 400 °C. Excellent process compatibility: Works with existing dispensing and screen‑printing equipment without major capital‑equipment modification. Superior comprehensive performance: High thermal conductivity, high electrical conductivity and high bonding strength for improved thermal and electrical performance of electronic assemblies. Eco‑friendly & reliable: Lead‑free and zero organic residue; suitable for high‑temperature, high‑power scenarios for third‑generation semiconductors. Application Fields New‑energy‑vehicle power‑control modules (IGBT / SiC packaging) RF components for 5G communication base stations High‑power LED chip packaging High‑reliability packaging for power electronics and optoelectronics Why Choose Xianyi? We deliver not merely materials, but high‑reliability, high‑thermal‑performance bonding solutions, enabling devices to sustain premium performance and extended service lifetime under high‑temperature and high‑power operating environments. Sintered silver paste represents more than material upgrading — it marks a revolution in thermal‑management technology. Partner with Xianyi toward efficient, dependable new‑energy and communication systems.For samples and technical solution support, please contact: +86‑13316249252
