Guangzhou XianYi Electronic technology Co.,Ltd.

Products

XianYi is a leading manufacturer and supplier of electronic packaging interconnection materials in China, providing highly reliable electronic packaging solutions. Dedicated to aerospace, microwave&RF, laser ,IR, optical communication, power electronics and other fields to provide Solder Preforms, AuSn Solder Paste, AuSn Solder Seal Lids, AuSn Thin Film Heat Sink, Nano-Ag Paste and AMB Ceramic Substrates and other products.

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Interconnecting Materials for Electronic Packaging

Solder Preforms

Over a hundred kinds of solder alloys (Au80Sn20, Au88Ge12, etc) available.
AuSn Solder Paste.

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Company Vision

Leading brand of semiconductor microassembly interconnecting materials.
We aim to becoming the integrated service provider of microelectronic packaging and semiconductor devices based on key materials, energizing semiconductor interconnections.

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Solutions

Applications & Solutions

Xianyi Electronics is a leading domestic manufacturer and supplier of electronic packaging interconnection materials, as well as a provider of high-reliability electronic packaging solutions.

We are dedicated to supplying preformed solder preforms, AuSn solder paste, AuSn lids, AuSn heat sinks, nano-silver materials, AMB ceramic copper clad substrates and other products for aerospace, microwave RF, laser & infrared, optical communication, power electronics and other sectors.

About Us

ABOUTS US

LEADING BRAND OF ADVANCED SEMICONDUCTOR PACKAGING MATERIALS

Guangzhou XianYi Electronic Technology Co., Ltd., founded in December 2008, is a national high-tech enterprise and national key specialized, sophisticated "Little Giant". We focus on the R&D, production and sales of highly reliable microelectronic packaging interconnect materials.

With nearly 20 years of development, we have built four independent core product lines: microelectronic packaging interconnect materials, high-performance metal thermal interface materials, integrated solder components, and third-generation power semiconductor packaging materials. Committed to localizing critical semiconductor materials, we strive to break overseas tech monopolies, realize independent control of core materials, advance high-end material import substitution, and support the high-quality growth of China’s semiconductor packaging sector.

18Years

Industry
Experience
5

Management
System
80+

Patented
Technologies
1800+

Customers

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News

News Center

The Five Technical Ladder Levels of Packaging Engineering

Many people assume packaging only means putting a housing around a chip. In reality, packaging engineering is a tiered integration system spanning from the die itself to the end product. It consists of five technical lev

2026-11-05

Push Cooling Boundaries! Xianyi Electronics Sintered Silver Paste Reinforces Power‑Package Reliability

Driven by rapid development of 5G communications, new‑energy vehicles and high‑power LEDs, conventional bonding materials can no longer satisfy increasingly rigorous thermal‑dissipation and reliability requirements. X

2026-11-05

Why TIM Is an Indispensable Critical Material for High‑Power Chips

Thermal Interface Material (TIM) serves as the critical intermediate layer connecting chips and heat sinks. Micro‑scale surface irregularities exist on chips, package lids and hea.

2026-11-05

Xianyi Electronics Science & Innovation Park Officially Completed and Put into Operation

On September 7, 2026, Guangzhou Xianyi Electronics Technology Co., Ltd. grandly held the *Advanced Packaging Materials & Innovative Processes Seminar* at Xianyi Electronics Science & Innovation Park.

2026-11-05

Show Report | Xianyi Electronics Debuts at the 27th China International Optoelectronic Exposition (CIOE) in Shenzhen, Showcasing Solder Materials and Integrated Packaging Solutions

The 27th CIOE opens at Shenzhen World Exhibition and Convention Center. Drawing over 5,000 exhibitors and 240,000+ professional attendees, this premier optoelectronics show welcomes Xianyi Electronics, China’s leader in

2026-11-04

Xianyi Makes Connections Warmer | Xianyi Electronics Wishes You a Full‑Moon Festival of Reunion and Every Success

With the Mid‑Autumn Festival approaching, osmanthus scents the air and the moon grows round. We send our warmest festive wishes to all dedicated employees and your families. Thank you for your enduring devotion.

2026-11-04