Guangzhou XianYi Electronic technology Co.,Ltd.

Products

XianYi is a leading manufacturer and supplier of electronic packaging interconnection materials in China, providing highly reliable electronic packaging solutions. Dedicated to aerospace, microwave&RF, laser ,IR, optical communication, power electronics and other fields to provide Solder Preforms, AuSn Solder Paste, AuSn Solder Seal Lids, AuSn Thin Film Heat Sink, Nano-Ag Paste and AMB Ceramic Substrates and other products.

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Interconnecting Materials for Electronic Packaging

Solder Preforms

Over a hundred kinds of solder alloys (Au80Sn20, Au88Ge12, etc) available.
AuSn Solder Paste.

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Company Vision

Leading brand of semiconductor microassembly interconnecting materials.
We aim to becoming the integrated service provider of microelectronic packaging and semiconductor devices based on key materials, energizing semiconductor interconnections.

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Solutions

Applications & Solutions

Xianyi Electronics is a leading domestic manufacturer and supplier of electronic packaging interconnection materials, as well as a provider of high-reliability electronic packaging solutions.

We are dedicated to supplying preformed solder preforms, AuSn solder paste, AuSn lids, AuSn heat sinks, nano-silver materials, AMB ceramic copper clad substrates and other products for aerospace, microwave RF, laser & infrared, optical communication, power electronics and other sectors.

About Us

ABOUTS US

LEADING BRAND OF ADVANCED SEMICONDUCTOR PACKAGING MATERIALS

Guangzhou XianYi Electronic Technology Co., Ltd., established in December 2008, is a national high-tech enterprise and a national key specialized and sophisticated "Little Giant" which specializes in R&D, production, and sales of high-reliability microelectronic packaging interconnect materials. After nearly two decades of development, XianYi continues to deepen its expertise in core underlying material technologies. Four major core product portfolios, including microelectronic packaging interconnect materials, high-performance metallic thermal interface materials, integrated solder components, and third-generation power semiconductor packaging materials, have been independently established. We are focusing on advancing the domestic production of key strategic semiconductor materials, breaking foreign technological monopolies and barriers, achieving self-sufficiency and control over core materials, and facilitating the import substitution of high-end materials – thereby empowering the high-quality development of the domestic semiconductor packaging industry.

18Years

Industry
Experience
5

Management
System
80+

Patented
Technologies
1800+

Customers

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News

News Center

The Five Technical Ladder Levels of Packaging Engineering

Many people assume packaging only means putting a housing around a chip. In reality, packaging engineering is a tiered integration system spanning from the die itself to the end product. It consists of five technical lev

2026-11-05

Push Cooling Boundaries! Xianyi Electronics Sintered Silver Paste Reinforces Power‑Package Reliability

Driven by rapid development of 5G communications, new‑energy vehicles and high‑power LEDs, conventional bonding materials can no longer satisfy increasingly rigorous thermal‑dissipation and reliability requirements. X

2026-11-05

Why TIM Is an Indispensable Critical Material for High‑Power Chips

Thermal Interface Material (TIM) serves as the critical intermediate layer connecting chips and heat sinks. Micro‑scale surface irregularities exist on chips, package lids and hea.

2026-11-05

Xianyi Electronics Science & Innovation Park Officially Completed and Put into Operation

On September 7, 2026, Guangzhou Xianyi Electronics Technology Co., Ltd. grandly held the *Advanced Packaging Materials & Innovative Processes Seminar* at Xianyi Electronics Science & Innovation Park.

2026-11-05

Show Report | Xianyi Electronics Debuts at the 27th China International Optoelectronic Exposition (CIOE) in Shenzhen, Showcasing Solder Materials and Integrated Packaging Solutions

The 27th CIOE opens at Shenzhen World Exhibition and Convention Center. Drawing over 5,000 exhibitors and 240,000+ professional attendees, this premier optoelectronics show welcomes Xianyi Electronics, China’s leader in

2026-11-04

Xianyi Makes Connections Warmer | Xianyi Electronics Wishes You a Full‑Moon Festival of Reunion and Every Success

With the Mid‑Autumn Festival approaching, osmanthus scents the air and the moon grows round. We send our warmest festive wishes to all dedicated employees and your families. Thank you for your enduring devotion.

2026-11-04